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Thursday, September 09, 2010 |
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CeramCoolŽ Ceramic Heat-Sink CeramCoolŽ can be metallized directly with thick or thin film processes such as conventional ceramic substrates. This makes the complete surface of the heat-sink useable as a circuit carrier while providing reliable electrical insulation. CeramCoolŽ material characteristics: - Electrical insulation - High volume resistivity - Thermal cycling stability - High breakthrough voltage - No corrosion - No water intrusion |
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