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Today's news
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BEST OF HIGH TECH
Syfer Technology: MLCCs for non-magnetic applications
However, RoHS requirements have dictated the use of lead-free solders, and the composition of these solders has resulted in an increase in soldering temperatures. This has caused solder leaching problems for the Ag/Pd termination, and meant alternative terminations have had to be found.
As copper is non-magnetic, one solution is to use a copper barrier instead of a nickel barrier, with a tin finish on top, and this is the solution Syfer has developed.
This copper barrier termination is offered with selected nonmagnetic C0G/NP0, High Q and X7R dielectrics, providing a fully non-magnetic component.
To meet high temperature 260ºC soldering reflow profiles as detailed in J-STD-020, C0G/NP0 dielectrics are supplied with sintered termination and X7R dielectrics are supplied with Syfer’s award winning FlexiCap™ termination.
Details (PDF)
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